Inventor · disambiguated record
Sukianto Rusli
Also filed as: RUSLI SUKIANTO
69 granted patents·3 pending applications·3,210 citations·filing 1995–2021
99Inventor score
Files withAMKOR TECHNOLOGY INC51CHIP SOLUTIONS LLC8HUEMOELLER RONALD PATRICK6AMKOR TECH SINGAPORE HOLDING PTE LTD3HINER DAVID JON2
Top patents by PatentIndex Score
72 records- 0199US9406645B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 2, 2016·40 cites·14 claims
- 0299US8710649B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 29, 2014·47 cites·20 claims
- 0399US7932595B1Electronic component package comprising fan-out tracesAMKOR TECHNOLOGY INC·Filed 2010·Granted Apr 26, 2011·66 cites·18 claims
- 0499US7842541B1Ultra thin package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2008·Granted Nov 30, 2010·169 cites·19 claims
- 0599US7714431B1Electronic component package comprising fan-out and fan-in tracesAMKOR TECHNOLOGY INC·Filed 2006·Granted May 11, 2010·98 cites·20 claims
- 0699US7671457B1Semiconductor package including top-surface terminals for mounting another semiconductor packageAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 2, 2010·233 cites·12 claims
- 0799US7548430B1Buildup dielectric and metallization process and semiconductor packageAMKOR TECHNOLOGY INC·Filed 2006·Granted Jun 16, 2009·202 cites·19 claims
- 0899US7192807B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2005·Granted Mar 20, 2007·139 cites·18 claims
- 0999US7185426B1Method of manufacturing a semiconductor packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 6, 2007·395 cites·20 claims
- 1099US6930256B1Integrated circuit substrate having laser-embedded conductive patterns and method thereforAMKOR TECHNOLOGY INC·Filed 2002·Granted Aug 16, 2005·235 cites·22 claims
- 1198US8341835B1Buildup dielectric layer having metallization pattern semiconductor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2009·Granted Jan 1, 2013·71 cites·20 claims
- 1298US7572681B1Embedded electronic component packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Aug 11, 2009·103 cites·19 claims
- 1398US7361533B1Stacked embedded leadframeAMKOR TECHNOLOGY INC·Filed 2005·Granted Apr 22, 2008·96 cites·20 claims
- 1498US7297562B1Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patternsAMKOR TECHNOLOGY INC·Filed 2005·Granted Nov 20, 2007·42 cites·22 claims
- 1598US6905914B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·117 cites·22 claims
- 1697US8026587B1Semiconductor package including top-surface terminals for mounting another semiconductor packageAMKOR TECHNOLOGY INC·Filed 2010·Granted Sep 27, 2011·24 cites·17 claims
- 1797US7632753B1Wafer level package utilizing laser-activated dielectric materialAMKOR TECHNOLOGY INC·Filed 2007·Granted Dec 15, 2009·55 cites·25 claims
- 1896US8298866B1Wafer level package and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Oct 30, 2012·16 cites·20 claims
- 1996US8119455B1Wafer level package fabrication methodHUEMOELLER RONALD PATRICK·Filed 2011·Granted Feb 21, 2012·15 cites·19 claims
- 2096US8110909B1Semiconductor package including top-surface terminals for mounting another semiconductor packageHINER DAVID JON·Filed 2010·Granted Feb 7, 2012·20 cites·16 claims
- 2196US7977163B1Embedded electronic component package fabrication methodAMKOR TECHNOLOGY INC·Filed 2009·Granted Jul 12, 2011·36 cites·18 claims
- 2296US7028400B1Integrated circuit substrate having laser-exposed terminalsAMKOR TECHNOLOGY INC·Filed 2003·Granted Apr 18, 2006·79 cites·20 claims
- 2396US6534391B1Semiconductor package having substrate with laser-formed aperture through solder mask layerAMKOR TECHNOLOGY INC·Filed 2001·Granted Mar 18, 2003·135 cites·27 claims
- 2495US7752752B1Method of fabricating an embedded circuit patternAMKOR TECHNOLOGY INC·Filed 2007·Granted Jul 13, 2010·34 cites·13 claims
- 2594US8691632B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 8, 2014·8 cites·20 claims
- 2694US8486764B1Wafer level package and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Jul 16, 2013·9 cites·20 claims
- 2794US8017436B1Thin substrate fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2007·Granted Sep 13, 2011·33 cites·23 claims
- 2894US7365006B1Semiconductor package and substrate having multi-level vias fabrication methodAMKOR TECHNOLOGY INC·Filed 2006·Granted Apr 29, 2008·27 cites·20 claims
- 2993US7589398B1Embedded metal features structureAMKOR TECHNOLOGY INC·Filed 2006·Granted Sep 15, 2009·26 cites·19 claims
- 3092US7190062B1Embedded leadframe semiconductor packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 13, 2007·73 cites·20 claims
- 3192US6930257B1Integrated circuit substrate having laminated laser-embedded circuit layersAMKOR TECHNOLOGY INC·Filed 2003·Granted Aug 16, 2005·62 cites·18 claims
- 3292US6831371B1Integrated circuit substrate having embedded wire conductors and method thereforAMKOR TECHNOLOGY INC·Filed 2002·Granted Dec 14, 2004·57 cites·23 claims
- 3391US7670962B2Substrate having stiffener fabrication methodAMKOR TECHNOLOGY INC·Filed 2007·Granted Mar 2, 2010·19 cites·25 claims
- 3490US8322030B1Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patternsHUEMOELLER RONALD PATRICK·Filed 2007·Granted Dec 4, 2012·11 cites·33 claims
- 3590US5861076AMethod for making multi-layer circuit boardsPARK ELECTROCHEMICAL CORP·Filed 1995·Granted Jan 19, 1999·124 cites·39 claims
- 3689US10332775B2Releasable carrier and methodCHIP SOLUTIONS LLC·Filed 2016·Granted Jun 25, 2019·4 cites·10 claims
- 3789US8383950B1Metal etch stop fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2011·Granted Feb 26, 2013·8 cites·18 claims
- 3888US10586746B2Semiconductor device and methodCHIP SOLUTIONS LLC·Filed 2017·Granted Mar 10, 2020·5 cites·20 claims
- 3988US9691635B1Buildup dielectric layer having metallization pattern semiconductor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2012·Granted Jun 27, 2017·8 cites·20 claims
- 4088US8176628B1Protruding post substrate package structure and methodRUSLI SUKIANTO·Filed 2008·Granted May 15, 2012·23 cites·12 claims
- 4188US7312103B1Method for making an integrated circuit substrate having laser-embedded conductive patternsAMKOR TECHNOLOGY INC·Filed 2004·Granted Dec 25, 2007·27 cites·20 claims
- 4287US7923645B1Metal etch stop fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2007·Granted Apr 12, 2011·13 cites·15 claims
- 4387US7911037B1Method and structure for creating embedded metal featuresAMKOR TECHNOLOGY INC·Filed 2009·Granted Mar 22, 2011·12 cites·20 claims
- 4486US11848214B2Encapsulated semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Dec 19, 2023·1 cites·20 claims
- 4586US9871015B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 16, 2018·2 cites·20 claims
- 4686US9054117B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2014·Granted Jun 9, 2015·3 cites·20 claims
- 4786US8826531B1Method for making an integrated circuit substrate having laminated laser-embedded circuit layersHINER DAVID JON·Filed 2005·Granted Sep 9, 2014·15 cites·14 claims
- 4885US8323771B1Straight conductor blind via capture pad structure and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2007·Granted Dec 4, 2012·13 cites·11 claims
- 4984US10461006B1Encapsulated semiconductor packageAMKOR TECHNOLOGY INC·Filed 2014·Granted Oct 29, 2019·4 cites·20 claims
- 5084US7145238B1Semiconductor package and substrate having multi-level viasAMKOR TECHNOLOGY INC·Filed 2004·Granted Dec 5, 2006·31 cites·20 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →