Inventor · disambiguated record
Tsukasa Kamakura
Also filed as: KAMAKURA TSUKASA
38 granted patents·8 pending applications·98 citations·filing 2006–2024
96Inventor score
Files withHITACHI INT ELECTRIC INC25KOKUSAI ELECTRIC CORP17HIROSE YOSHIRO2AKAE NAONORI1TAKASAWA YUSHIN1
Top patents by PatentIndex Score
46 records- 0195US11967534B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 23, 2024·3 cites·20 claims
- 0295US10211110B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2018·Granted Feb 19, 2019·13 cites·10 claims
- 0393US9732421B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 15, 2017·5 cites·9 claims
- 0491US11251039B2Method of manufacturing semiconductor device, recording medium, and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 15, 2022·2 cites·21 claims
- 0591US10655218B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted May 19, 2020·4 cites·13 claims
- 0691US9472391B2Semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 18, 2016·11 cites·17 claims
- 0790US9349586B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted May 24, 2016·8 cites·18 claims
- 0890US9028648B1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted May 12, 2015·9 cites·18 claims
- 0986US10121650B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2018·Granted Nov 6, 2018·4 cites·16 claims
- 1086US8546272B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusHIROSE YOSHIRO·Filed 2011·Granted Oct 1, 2013·6 cites·9 claims
- 1185US9190298B2Film forming method and recording medium for performing the methodHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 17, 2015·5 cites·16 claims
- 1284US11810781B2Method of processing substrate, substrate processing apparatus, recording medium, method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 7, 2023·1 cites·20 claims
- 1383US10808318B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 20, 2020·3 cites·10 claims
- 1483US9916976B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Mar 13, 2018·4 cites·12 claims
- 1583US9455137B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 27, 2016·3 cites·24 claims
- 1680US10784116B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Sep 22, 2020·3 cites·17 claims
- 1777US12249503B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Mar 11, 2025·0 cites·21 claims
- 1876US11848201B2Method of manufacturing semiconductor device, recording medium, and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 19, 2023·0 cites·22 claims
- 1976US8946092B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Granted Feb 3, 2015·2 cites·19 claims
- 2073US8410001B2Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatusTAKASAWA YUSHIN·Filed 2011·Granted Apr 2, 2013·3 cites·15 claims
- 2171US11251038B2Method of manufacturing semiconductor device, recording medium, and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 15, 2022·0 cites·18 claims
- 2270US10671056B2Substrate processing systemHITACHI INT ELECTRIC INC·Filed 2017·Granted Jun 2, 2020·1 cites·17 claims
- 2370US10388512B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Aug 20, 2019·1 cites·8 claims
- 2470US9953830B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Apr 24, 2018·2 cites·12 claims
- 2569US9831082B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 28, 2017·1 cites·16 claims
- 2668US9520282B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Dec 13, 2016·1 cites·14 claims
- 2767US9673043B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jun 6, 2017·1 cites·13 claims
- 2866US9449813B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Sep 20, 2016·1 cites·11 claims
- 2965US9378943B2Method of manufacturing semiconductor device, method of processing substrate substrate processing apparatus and non-transitory computer-readable recording mediumHIROSE YOSHIRO·Filed 2012·Granted Jun 28, 2016·1 cites·14 claims
- 3062US2025014924A1Substrate processing apparatus, substrate processing system, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3162US2025014930A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3260US11726456B2Substrate processing systemKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 15, 2023·0 cites·17 claims
- 3357US2015101755A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 3455US2016322212A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
- 3554US10847392B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 24, 2020·0 cites·19 claims
- 3653US12053805B2Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 6, 2024·0 cites·21 claims
- 3753US11728162B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Aug 15, 2023·0 cites·25 claims
- 3850US10978310B2Method of manufacturing semiconductor device and non-transitory computer-readable recording medium capable of adjusting substrate temperatureKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 13, 2021·0 cites·17 claims
- 3949US2022301851A1Method of manufacturing semiconductor device, substrate processing method, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4048US10714316B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Granted Jul 14, 2020·0 cites·19 claims
- 4145US9831083B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Nov 28, 2017·0 cites·14 claims
- 4245US2015275357A1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 4344US2014287599A1Substrate processing apparatus, process container, and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 4442US12217959B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Feb 4, 2025·0 cites·8 claims
- 4538US9640387B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted May 2, 2017·0 cites·21 claims
- 4638US2010136773A1Semiconductor Device Manufacturing Method and Substrate Processing ApparatusAKAE NAONORI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →