Inventor · disambiguated record
Uday Mitra
Also filed as: MITRA UDAY
23 granted patents·4 pending applications·78 citations·filing 1992–2022
93Inventor score
Top patents by PatentIndex Score
27 records- 0191US9548201B2Self-aligned multiple spacer patterning schemes for advanced nanometer technologyAPPLIED MATERIALS INC·Filed 2015·Granted Jan 17, 2017·6 cites·14 claims
- 0290US10424507B2Fully self-aligned viaMICROMATERIALS LLC·Filed 2017·Granted Sep 24, 2019·5 cites·13 claims
- 0389US10600688B2Methods of producing self-aligned viasMICROMATERIALS LLC·Filed 2018·Granted Mar 24, 2020·6 cites·17 claims
- 0487US10553485B2Methods of producing fully self-aligned vias and contactsMICROMATERIALS LLC·Filed 2018·Granted Feb 4, 2020·5 cites·14 claims
- 0582US10790191B2Selective removal process to create high aspect ratio fully self-aligned viaMICROMATERIALS LLC·Filed 2019·Granted Sep 29, 2020·3 cites·15 claims
- 0680US10622221B2Methods of etching metal oxides with less etch residueAPPLIED MATERIALS INC·Filed 2018·Granted Apr 14, 2020·2 cites·20 claims
- 0779US11437274B2Fully self-aligned viaMICROMATERIALS LLC·Filed 2020·Granted Sep 6, 2022·1 cites·9 claims
- 0876US10593594B2Selectively etched self-aligned via processesMICROMATERIALS LLC·Filed 2018·Granted Mar 17, 2020·2 cites·20 claims
- 0975US10892187B2Method for creating a fully self-aligned viaMICROMATERIALS LLC·Filed 2019·Granted Jan 12, 2021·2 cites·13 claims
- 1072US9978596B2Self-aligned multiple spacer patterning schemes for advanced nanometer technologyAPPLIED MATERIALS INC·Filed 2016·Granted May 22, 2018·1 cites·7 claims
- 1169US10699953B2Method for creating a fully self-aligned viaMICROMATERIALS LLC·Filed 2019·Granted Jun 30, 2020·1 cites·20 claims
- 1266US8101525B2Method for fabricating a semiconductor device having a lanthanum-family-based oxide layerSHEN MEIHUA·Filed 2009·Granted Jan 24, 2012·4 cites·21 claims
- 1365US11232955B2Methods of etching metal oxides with less etch residueAPPLIED MATERIALS INC·Filed 2020·Granted Jan 25, 2022·0 cites·19 claims
- 1465US5250444ARapid plasma hydrogenation process for polysilicon MOSFETsPHILIPS CORP·Filed 1992·Granted Oct 5, 1993·40 cites·9 claims
- 1563US11705366B2Methods for controllable metal and barrier-liner recessMICROMATERIALS LLC·Filed 2021·Granted Jul 18, 2023·0 cites·5 claims
- 1663US10522404B2Fully self-aligned viaMICROMATERIALS LLC·Filed 2019·Granted Dec 31, 2019·0 cites·6 claims
- 1763US2022359289A1Fully self-aligned viaMICROMATERIALS LLC·Filed 2022·Application pending·0 cites
- 1862US10410921B2Fully self-aligned viaMICROMATERIALS LLC·Filed 2019·Granted Sep 10, 2019·0 cites·14 claims
- 1962US2020098633A1Fully self-aligned viaZHANG YING·Filed 2019·Application pending·0 cites
- 2061US11164938B2DRAM capacitor moduleMICROMATERIALS LLC·Filed 2020·Granted Nov 2, 2021·0 cites·16 claims
- 2161US2022013624A1DRAM Capacitor ModuleMICROMATERIALS LLC·Filed 2021·Application pending·0 cites
- 2260US11037825B2Selective removal process to create high aspect ratio fully self-aligned viaMICROMATERIALS LLC·Filed 2020·Granted Jun 15, 2021·0 cites·10 claims
- 2354US11062942B2Methods for controllable metal and barrier-liner recessMICROMATERIALS LLC·Filed 2018·Granted Jul 13, 2021·0 cites·8 claims
- 2446US10892183B2Methods for removing metal oxidesMICROMATERIALS LLC·Filed 2019·Granted Jan 12, 2021·0 cites·16 claims
- 2544US10573555B2Methods of producing self-aligned grown viaMICROMATERIALS LLC·Filed 2018·Granted Feb 25, 2020·0 cites·16 claims
- 2643US10510602B2Methods of producing self-aligned viasMICROMATERIALS LLC·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 2739US2019198392A1Methods of etching a tungsten layerAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →