Inventor · disambiguated record
Yuji Takebayashi
Also filed as: TAKEBAYASHI YUJI
34 granted patents·32 pending applications·667 citations·filing 1995–2025
96Inventor score
Files withKOKUSAI ELECTRIC CORP27HITACHI INT ELECTRIC INC24TAKEBAYASHI YUJI3MIYA HIRONOBU2SAKAI MASANORI2
Top patents by PatentIndex Score
66 records- 0198US9708708B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 18, 2017·465 cites·14 claims
- 0295US8461062B2Substrate processing apparatus and method for manufacturing semiconductor deviceSAKAI MASANORI·Filed 2011·Granted Jun 11, 2013·10 cites·8 claims
- 0392US8828141B2Substrate processing apparatus and method for manufacturing semiconductor deviceSAKAI MASANORI·Filed 2009·Granted Sep 9, 2014·11 cites·21 claims
- 0489US8343277B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Granted Jan 1, 2013·10 cites·12 claims
- 0586US2025349584A1Substrate transport system, substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0684US12387962B2Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 0784US8420552B2Method of manufacturing a semiconductor deviceTAKEBAYASHI YUJI·Filed 2010·Granted Apr 16, 2013·6 cites·2 claims
- 0883US10640869B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted May 5, 2020·3 cites·9 claims
- 0982USD655255SBoat of wafer processing apparatusTAKEBAYASHI YUJI·Filed 2010·Granted Mar 6, 2012·29 cites·1 claims
- 1080US8866271B2Semiconductor device manufacturing method, substrate processing apparatus and semiconductor deviceYAMAMOTO KATSUHIKO·Filed 2011·Granted Oct 21, 2014·5 cites·9 claims
- 1180USD610559SReaction tubeHITACHI INT ELECTRIC INC·Filed 2008·Granted Feb 23, 2010·26 cites·1 claims
- 1279USD655682SBoat of wafer processing apparatusTAKEBAYASHI YUJI·Filed 2010·Granted Mar 13, 2012·26 cites·1 claims
- 1378US2025308945A1Cleaning method, method of manufacturing semiconductor device, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1477US11996311B2Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted May 28, 2024·0 cites·17 claims
- 1577US11020760B2Substrate processing apparatus and precursor gas nozzleHITACHI INT ELECTRIC INC·Filed 2017·Granted Jun 1, 2021·3 cites·10 claims
- 1676US9496134B2Substrate processing apparatus, method of manufacturing semiconductor device and semiconductor deviceSASAKI SHINYA·Filed 2011·Granted Nov 15, 2016·4 cites·10 claims
- 1776US8481434B2Method of manufacturing a semiconductor device and processing apparatusMIYA HIRONOBU·Filed 2008·Granted Jul 9, 2013·6 cites·15 claims
- 1876US2025327183A1Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1974US12476129B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Nov 18, 2025·0 cites·16 claims
- 2072US2025259873A1Substrate processing apparatus, elevator and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2171US11869790B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jan 9, 2024·0 cites·15 claims
- 2271US11031270B2Substrate processing apparatus, substrate holder and mounting toolKOKUSAI ELECTRIC CORP·Filed 2018·Granted Jun 8, 2021·1 cites·9 claims
- 2370US9437421B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Sep 6, 2016·2 cites·10 claims
- 2469US9768012B2Method for processing substrate and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 19, 2017·1 cites·19 claims
- 2568US2009197424A1Substrate processing apparatus and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 2667US9646821B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted May 9, 2017·1 cites·6 claims
- 2767US5957651ASubstrate carrying apparatusKOKUSAI ELECTRIC CO LTD·Filed 1996·Granted Sep 28, 1999·40 cites·22 claims
- 2866US12371788B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 29, 2025·0 cites·12 claims
- 2966US12293932B2Substrate processing apparatus, elevator and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted May 6, 2025·0 cites·13 claims
- 3065US12509768B2Method of manufacturing semiconductor device, substrate processing apparatus and evaporation systemKOKUSAI ELECTRIC CORP·Filed 2021·Granted Dec 30, 2025·0 cites·20 claims
- 3165US8741731B2Method of manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2012·Granted Jun 3, 2014·1 cites·17 claims
- 3264US12354887B2Cleaning method, method of manufacturing semiconductor device, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 8, 2025·0 cites·15 claims
- 3361US12435423B2Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Oct 7, 2025·0 cites·19 claims
- 3461US2025340993A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3560US2025014894A1Substrate Processing Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3660US2024186156A1Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3760US2009325389A1Substrate processing apparatus and manufacturing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 3859US2024003012A1Substrate processing apparatus, heating apparatus, method of processing substrate and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3957US2010009079A1Method for processing substrate and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 4056USD828091SGas supply nozzleHITACHI INT ELECTRIC INC·Filed 2016·Granted Sep 11, 2018·8 cites·1 claims
- 4155US7820686B2Therapeutic agent for inflammatory bowel diseaseTAIHO PHARMACEUTICAL CO LTD·Filed 2007·Granted Oct 26, 2010·0 cites·3 claims
- 4255US2023230861A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 4354US2025215568A1Substrate Processing Apparatus, Gas Supply Assembly, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-Readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4452US2022208530A1Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4552US2022145465A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4651US5798213AMonoclonal antibodiesTAIHO PHARMACEUTICAL CO LTD·Filed 1995·Granted Aug 25, 1998·9 cites·6 claims
- 4751US2013267100A1Method of manufacturing semiconductor device, substrate processing apparatus and evaporation systemHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 4850US2013137279A1Exhaust Unit, Substrate Processing Apparatus, and Method of Manufacturing Semiconductor DeviceHITACHI INT ELECTRIC INC·Filed 2012·Application pending·0 cites
- 4949US2010087069A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 5049US2023100702A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Yuji Takebayashi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →