US2011294289A1PendingUtilityA1

Method for Producing a Connection Electrode for Two Semiconductor Zones Arranged One Above Another

Assignee: REIGER WALTERPriority: Sep 26, 2005Filed: Nov 23, 2010Published: Dec 1, 2011
Est. expirySep 26, 2025(expired)· nominal 20-yr term from priority
H10P 30/222H10P 32/171H10P 32/141H10D 64/2527H10D 62/83H10D 64/513H10D 64/256H10D 64/62H10D 62/155H10D 62/153H10D 62/393H10D 30/0297H10D 30/0295H10D 12/481H10D 12/038H10D 30/668H10P 30/221
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Claims

Abstract

A method for producing a connection electrode for a first and second adjacent and complementarily doped semiconductor zones includes a step of producing a trench extending through the first semiconductor zone into the second semiconductor zone in such a way that the first semiconductor zone is uncovered at sidewalls of the trench and the second semiconductor zone is uncovered at least at a bottom of the trench. The method also includes producing a first connection zone in the first semiconductor zone by implanting dopant atoms into the sidewalls at least at a first angle. The method further includes producing a second connection zone in the second semiconductor zone by implanting dopant atoms at least at a second, different angle. The method also includes depositing an electrode layer at least onto the sidewalls and the bottom of the trench for the purpose of producing the connection electrode.

Claims

exact text as granted — not AI-modified
1 . A method for producing a connection electrode for a first semiconductor zone and a second semiconductor zone, which are arranged one above another and are doped complementarily with respect to one another, the method comprising:
 producing a trench extending through the first semiconductor zone into the second semiconductor zone in such a way that the first semiconductor zone is uncovered at sidewalls of the trench and the second semiconductor zone is uncovered at least at a bottom of the trench,   producing a first connection zone in the first semiconductor zone by implanting dopant atoms into the sidewalls at least at a first angle relative to the sidewalls, and is performed after the trench has been produced,   producing a second connection zone in the second semiconductor zone by implanting dopant atoms at least at a second angle, which is different from the first angle, relative to the sidewalls,   depositing an electrode layer at least onto the sidewalls and the bottom of the trench for the purpose of producing the connection electrode.   
     
     
         2 . The method as claimed in  claim 1 , wherein, prior to the production of the electrode layer, a barrier layer is applied to the sidewalls and the bottom of the trench. 
     
     
         3 . The method as claimed in  claim 2 , wherein, prior to producing the first connection zone, a screen layer is applied to the sidewalls and the bottom of the trench. 
     
     
         4 . The method as claimed in  claim 1 , wherein the first angle relative to the sidewalls is greater than the second angle relative to the sidewalls. 
     
     
         5 . The method as claimed in  claim 4 , wherein, prior to the production of the electrode layer, a barrier layer is applied to the sidewalls and the bottom of the trench. 
     
     
         6 . The method as claimed in  claim 4 , wherein, prior to producing the first connection zone, a screen layer is applied to the sidewalls and the bottom of the trench. 
     
     
         7 . The method as claimed in  claim 6 , wherein, prior to the production of the electrode layer, a barrier layer is applied to the sidewalls and the bottom of the trench. 
     
     
         8 . The method as claimed in  claim 1 , wherein, prior to producing the first connection zone, a screen layer is applied to the sidewalls and the bottom of the trench.

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