Coating system and method for coating interior fluid wetted surfaces of a component of a semiconductor substrate processing apparatus

Abstract

A fluid handling component for a vacuum chamber of a semiconductor substrate processing apparatus is provided. The fluid handling component comprises interior fluid wetted surfaces and an atomic layer deposition (ALD) or molecular layer deposition (MLD) barrier coating on the interior fluid wetted surfaces wherein the fluid wetted surfaces which include the ALD or MLD barrier coating are configured to be contacted by a process gas and/or fluid during a semiconductor substrate processing process wherein the ALD or MLD barrier coating protects the underlying fluid wetted surfaces from erosion and/or corrosion.

What is claimed is: 
     
         1 . A fluid handling component for a vacuum chamber of a semiconductor substrate processing apparatus, the fluid handling component comprising interior fluid wetted surfaces and an atomic layer deposition (ALD) or molecular layer deposition (MLD) barrier coating on the interior fluid wetted surfaces wherein the fluid wetted surfaces including the ALD or MLD barrier coating are configured to be contacted by a process gas and/or fluid during a semiconductor substrate processing process wherein the ALD or MLD barrier coating protects the underlying fluid wetted surfaces from erosion and/or corrosion. 
     
     
         2 . The fluid handling component of  claim 1 , wherein the fluid handling component is an exhaust assembly, a gas delivery system, a gas box, a gas stick, a proximity head, an air filtering unit, a deionized water circulation system, a facility line, a gas line, a gas distribution system including a gas switching section, a temperature controlled top plate, a temperature controlled base plate, and/or a diffuser of the vacuum chamber of the semiconductor substrate processing apparatus. 
     
     
         3 . The fluid handling component of  claim 1 , wherein the ALD barrier coating includes tantalum (Ta), titanium (Ti), tungsten (W), zirconium (Zr), hafnium (Hf), molybdenum (Mo), niobium (Nb), vanadium (V), ruthenium (Ru) and/or chromium (Cr) and mixtures and/or alloys thereof. 
     
     
         4 . The fluid handling component of  claim 1 , wherein the ALD barrier coating is:
 (a) an oxide, nitride, or fluoride material; and/or   (b) aluminum oxide (Al 2 O 3 ).   
     
     
         5 . The fluid handling component of  claim 1 , wherein the MLD barrier coating is:
 (a) a polyamide, a polyimide, a polyuria, a polythiourea, a polyurethane, a polyazomethine, or a polyester material; and/or   (b) an organic, or an organic-inorganic hybrid material.   
     
     
         6 . The fluid handling component of  claim 1  wherein thickness of the ALD or MLD barrier coating is about 0.1 to 500 nm or greater. 
     
     
         7 . The fluid handling component of  claim 1 , wherein the interior fluid wetted surfaces comprises a plurality of parts that are pre-assembled and vacuum sealed before formation of the ALD or MLD barrier coating. 
     
     
         8 . The fluid handling component of  claim 7 , the plurality of parts when pre-assembled is configured to form a process space for the ALD or MLD barrier coating.