USD634719SActiveUtility

Elastic membrane for semiconductor wafer polishing apparatus

Assignee: EBARA CORPPriority: Aug 27, 2009Filed: Feb 25, 2010Granted: Mar 22, 2011

Est. expiryAug 27, 2029(~3.1 yrs left)· nominal 20-yr term from priority

PatentIndex Score

539

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Claims

exact text as granted — not AI-modified

The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.

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