Processing system

Abstract

A processing system has an upper electrode with gas discharge holes of a shape corresponding to the external we of insulating members. The insulating members are formed of a poly(ether etherketone) resin, a polyimide resin, a poly (ether imide) resin or the like. Each insulating member has a step at its outer surface and an internal longitudinal through hole tapered to expand toward the processing chamber. The insulating members are pressed in the gas discharge holes to bring the steps into contact with shoulders formed in the sidewalls of the gas discharge holes. A part of each insulting member, as fitted in the gas discharge hole, projects from a surface of the upper electrode that faces a susceptor.

1. A processing system comprising:
 a processing vessel defining an airtight processing chamber;    an upper electrode disposed in an upper region of the processing chamber;    a lower electrode disposed below and opposite to the upper electrode in the processing chamber; and    a radio frequency power source connected at least to either the upper or the lower electrode;    wherein the upper electrode includes a side facing into the processing chamber towards the lower electrode, the upper electrode side having a plurality gas discharge holes to supply a predetermined process gas therethrough into the processing chamber,    resin insulating members, each provided with a through hole permitting the process gas to pass through, are fitted from the upper electrode side facing the processing chamber into the gas discharge holes, respectively,    each of the gas discharge holes is provided with a shoulder,    each of the insulating members is provided with a step, and    each of the insulating members are positioned in the gas discharge hole with its step in contact with the shoulder of the gas discharge hole.    
     
     
       2. The processing system according to  claim 1 , wherein the insulating members are fitted in the gas discharge holes of the upper electrode to project into the processing chamber. 
     
     
       3. The processing system according to  claim 1 , wherein each of the insulating members is provided with a flange capable of covering the rim of an end of the gas discharge hole on the side of the processing chamber. 
     
     
       4. The processing system according to  claim 1 , wherein at least part of the sidewall of each of the gas discharge holes between an open end thereof on the side of the processing chamber and the shoulder thereof is finished by a plasma-proofing process, and a part of the sidewall of each gas discharge hole between the shoulder and the open end opening into a gas supply passage is not finished by the plasma-proofing process. 
     
     
       5. The processing system according to  claim 4 , wherein the insulating members are formed of a resin. 
     
     
       6. The processing system according to  claim 1 , wherein each of the insulating members has a length and the length of the insulating members is shorter than that of the gas discharge holes. 
     
     
       7. The processing system according to  claim 1 , wherein at least part of the through hole of each insulating member is substantially tapered so as to expand toward the processing chamber. 
     
     
       8. A processing system comprising:
 a processing vessel defining an airtight processing chamber;    an upper electrode disposed in an upper region of the processing chamber;    a lower electrode disposed below and opposite to the upper electrode in the processing chamber; and    a radio frequency power source connected at least to either the upper or the lower electrode;    wherein the upper electrode has an upper electrode member and a cooling plate disposed on the upper electrode member,    the upper electrode member and the cooling plate are provided with a plurality of gas discharge holes through which a predetermined process gas is supplied into the processing chamber,    resin insulating members, each provided with a through hole permitting the process gas to flow through, are fitted into the gas discharge holes to cover the sidewalls of the gas discharge holes, each of the discharge holes being formed as a through hole passing through the upper electrode member and the cooling plate,    each of the gas discharge holes of the cooling plate is provided with a shoulder,    each of the insulating members is provided with a step, and    the insulating members are positioned in the gas discharge holes with the steps thereof resting on the shoulders of the corresponding gas discharge holes, each of the insulating members is fitted into the cooling plate from an opposite side to the upper electrode member.    
     
     
       9. The processing system according to  claim 8 , wherein at least an end part of the through hole of each insulating member on the side of the processing chamber is substantially tapered to expand toward the processing chamber. 
     
     
       10. A method of use of an upper electrode disposable in an upper region of a processing chamber, said upper electrode provided with a plurality of gas discharge holes to supply a predetermined process gas therethrough into the processing chamber; each of the gas discharge holes provided with a shoulder; and resin insulating members, each provided with a through hole permitting a process gas to pass through and a step, said method comprising the steps of
   inserting one of said insulating members into one of said gas discharge holes;        pressing said one insulating member in said one hole such that said step of said insulating member contacts said shoulder of said one hole such that an edge of said one hole is not exposed to plasma produced in the chamber; and        repeating said inserting and pressing steps until all said gas discharge holes of said upper electrode have been provided each with the insulating member.     
     
     
       11. The method according to  claim 10 , wherein said insulating members are pressed into said gas discharge holes to project into the processing chamber. 
     
     
       12. The method according to  claim 10 , wherein each of said insulating members is provided with a flange capable of covering a rim of an end of each of said gas discharge holes. 
     
     
       13. The method according to  claim 10 , further comprising the steps of performing a plasma- proofing process on at least part of a sidewall of each of said gas discharge holes between an open end thereof on a side of the processing chamber and said shoulder thereof, and      omitting performance of said plasma - proofing process at a part of said sidewall of each said gas discharge holes between said shoulder and an open - end thereof opening into a gas supply passage.     
     
     
       14. The method according to  claim 13 , further comprising the step of providing resin members as said insulating members. 
     
     
       15. The method according to  claim 14 , wherein said resin insulating members are inserted and pressed into said gas discharge holes, respectively, from a side of the processing chamber. 
     
     
       16. The method according to  claim 10 , further comprising the steps of providing said insulating members so that they have a length that is relatively shorter than that of said gas discharge holes. 
     
     
       17. The method according to  claim 10 , further comprising the step of providing said insulating members so that at least part of the through hole of each said insulating members is substantially tapered to expand toward said processing chamber.