Inventor · disambiguated record
Jungrae Park
Also filed as: PARK JUNGRAE
28 granted patents·6 pending applications·162 citations·filing 2010–2024
95Inventor score
Top patents by PatentIndex Score
34 records- 0195US9355907B1Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch processLEI WEI-SHENG·Filed 2015·Granted May 31, 2016·14 cites·17 claims
- 0295US9165832B1Method of die singulation using laser ablation and induction of internal defects with a laserPAPANU JAMES S·Filed 2014·Granted Oct 20, 2015·53 cites·20 claims
- 0395US8991329B1Wafer coatingAPPLIED MATERIALS INC·Filed 2014·Granted Mar 31, 2015·19 cites·20 claims
- 0493US9601375B2UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approachLEI WEI-SHENG·Filed 2015·Granted Mar 21, 2017·9 cites·17 claims
- 0592US9012305B1Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening cleanLEI WEI-SHENG·Filed 2014·Granted Apr 21, 2015·12 cites·15 claims
- 0688US10903121B1Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2019·Granted Jan 26, 2021·4 cites·20 claims
- 0787US9349648B2Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch processLEI WEI-SHENG·Filed 2014·Granted May 24, 2016·7 cites·13 claims
- 0887US9245803B1Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2014·Granted Jan 26, 2016·7 cites·14 claims
- 0986US10363629B2Mitigation of particle contamination for wafer dicing processesAPPLIED MATERIALS INC·Filed 2017·Granted Jul 30, 2019·3 cites·21 claims
- 1086US9852997B2Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2016·Granted Dec 26, 2017·4 cites·12 claims
- 1184US9972575B2Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2016·Granted May 15, 2018·3 cites·13 claims
- 1284US9196536B1Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch processPARK JUNGRAE·Filed 2014·Granted Nov 24, 2015·6 cites·21 claims
- 1384US9130030B1Baking tool for improved wafer coating processAPPLIED MATERIALS INC·Filed 2014·Granted Sep 8, 2015·5 cites·24 claims
- 1482US9177861B1Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profilePARK JUNGRAE·Filed 2014·Granted Nov 3, 2015·5 cites·20 claims
- 1578US9038483B2Wireless passive radio-frequency strain and displacement sensorsNAGARAJAN RAMASWAMY·Filed 2010·Granted May 26, 2015·7 cites·26 claims
- 1676US12437999B2Methods and apparatus for mask patterning debris removalAPPLIED MATERIALS INC·Filed 2024·Granted Oct 7, 2025·0 cites·12 claims
- 1773US10661383B2Mitigation of particle contamination for wafer dicing processesAPPLIED MATERIALS INC·Filed 2019·Granted May 26, 2020·0 cites·5 claims
- 1871US9105710B2Wafer dicing method for improving die packaging qualityAPPLIED MATERIALS INC·Filed 2013·Granted Aug 11, 2015·2 cites·20 claims
- 1971US2024079273A1Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approachAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2066US2022246476A1Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2165US9299611B2Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistanceLEI WEI-SHENG·Filed 2014·Granted Mar 29, 2016·1 cites·26 claims
- 2265US9281244B1Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch processPARK JUNGRAE·Filed 2014·Granted Mar 8, 2016·1 cites·8 claims
- 2363US12068159B2Methods and apparatus for mask patterning debris removalAPPLIED MATERIALS INC·Filed 2021·Granted Aug 20, 2024·0 cites·8 claims
- 2463US11854888B2Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approachAPPLIED MATERIALS INC·Filed 2020·Granted Dec 26, 2023·0 cites·7 claims
- 2560US11342226B2Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2019·Granted May 24, 2022·0 cites·12 claims
- 2659US11217536B2Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2018·Granted Jan 4, 2022·0 cites·7 claims
- 2758US2021233816A1Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 2857US11011424B2Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2019·Granted May 18, 2021·0 cites·14 claims
- 2951US9768014B2Wafer coatingAPPLIED MATERIALS INC·Filed 2015·Granted Sep 19, 2017·0 cites·10 claims
- 3050US11901232B2Automatic kerf offset mapping and correction system for laser dicingAPPLIED MATERIALS INC·Filed 2020·Granted Feb 13, 2024·0 cites·10 claims
- 3145US10535561B2Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2018·Granted Jan 14, 2020·0 cites·10 claims
- 3243US2015243559A1Hybrid wafer dicing approach using temporally-controlled laser scribing process and plasma etchPARK JUNGRAE·Filed 2014·Application pending·0 cites
- 3343US2015287638A1Hybrid wafer dicing approach using collimated laser scribing process and plasma etchPARK JUNGRAE·Filed 2014·Application pending·0 cites
- 3440US2021202334A1Methods and apparatus for wafer-level packaging using direct writingAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →