Inventor · disambiguated record
Kazuyuki Okuda
Also filed as: OKUDA KAZUYUKI
38 granted patents·22 pending applications·268 citations·filing 1994–2025
97Inventor score
Files withHITACHI INT ELECTRIC INC24KOKUSAI ELECTRIC CORP17OKUDA KAZUYUKI5MIZUNO NORIKAZU3MIYA HIRONOBU2
Top patents by PatentIndex Score
60 records- 0196US7900580B2Substrate processing apparatus and reaction containerHITACHI INT ELECTRIC INC·Filed 2007·Granted Mar 8, 2011·27 cites·13 claims
- 0295US6905549B2Vertical type semiconductor device producing apparatusHITACHI INT ELECTRIC INC·Filed 2003·Granted Jun 14, 2005·60 cites·12 claims
- 0394US8956984B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2012·Granted Feb 17, 2015·15 cites·19 claims
- 0493US8261692B2Substrate processing apparatus and reaction containerKONTANI TADASHI·Filed 2010·Granted Sep 11, 2012·10 cites·7 claims
- 0593US7779785B2Production method for semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2006·Granted Aug 24, 2010·21 cites·3 claims
- 0692US11705325B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jul 18, 2023·1 cites·21 claims
- 0792US8227346B2Method of producing semiconductor deviceMIYA HIRONOBU·Filed 2011·Granted Jul 24, 2012·12 cites·10 claims
- 0890US8047158B2Substrate processing apparatus and reaction containerHITACHI INT ELECTRIC INC·Filed 2007·Granted Nov 1, 2011·8 cites·11 claims
- 0990US8039404B2Production method for semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2010·Granted Oct 18, 2011·9 cites·3 claims
- 1088US8575042B2Method of manufacturing semiconductor device and method of processing substrate and substrate processing apparatusOTA YOSUKE·Filed 2012·Granted Nov 5, 2013·7 cites·14 claims
- 1186US9218955B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Dec 22, 2015·7 cites·13 claims
- 1285US8366868B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2012·Granted Feb 5, 2013·4 cites·2 claims
- 1385US8176871B2Substrate processing apparatusOKUDA KAZUYUKI·Filed 2007·Granted May 15, 2012·11 cites·7 claims
- 1484US12266522B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Apr 1, 2025·0 cites·17 claims
- 1584US8105957B2Method of producing semiconductor deviceMIYA HIRONOBU·Filed 2009·Granted Jan 31, 2012·7 cites·12 claims
- 1683US10640869B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted May 5, 2020·3 cites·9 claims
- 1783US9169553B2Semiconductor device producing methodSAKAI MASANORI·Filed 2011·Granted Oct 27, 2015·2 cites·3 claims
- 1883US2025022702A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1982US9177786B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Nov 3, 2015·5 cites·13 claims
- 2081US12142476B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 12, 2024·0 cites·21 claims
- 2181US11361961B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 14, 2022·1 cites·17 claims
- 2281US9895727B2Method of manufacturing semiconductor device, method of cleaning interior of process chamber, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Feb 20, 2018·3 cites·21 claims
- 2380US7622396B2Method of producing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2008·Granted Nov 24, 2009·2 cites·20 claims
- 2479US8211802B2Substrate processing apparatusOKUDA KAZUYUKI·Filed 2010·Granted Jul 3, 2012·3 cites·11 claims
- 2578US2025201551A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2677US11915927B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 27, 2024·0 cites·19 claims
- 2777US9593422B2Substrate processing apparatus and semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 14, 2017·2 cites·8 claims
- 2875US8054201B2Surroundings monitoring device for vehicleMAZDA MOTOR·Filed 2009·Granted Nov 8, 2011·12 cites·14 claims
- 2973US8535479B2Manufacturing method of semiconductor device, and semiconductor deviceMIZUNO NORIKAZU·Filed 2011·Granted Sep 17, 2013·2 cites·10 claims
- 3073US8093159B2Manufacturing method of semiconductor device, and semiconductor deviceMIZUNO NORIKAZU·Filed 2008·Granted Jan 10, 2012·3 cites·30 claims
- 3172US2025226207A1Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3270US12288683B2Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 29, 2025·0 cites·14 claims
- 3369US11527401B2Method of processing substate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 3467US2009176017A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 3566US6938190B2Failure detector for communication network in automobileDENSO CORP·Filed 2001·Granted Aug 30, 2005·10 cites·18 claims
- 3662US2011176967A1Vertical type semiconductor device producing apparatusOKUDA KAZUYUKI·Filed 2011·Application pending·0 cites
- 3761US9175395B2Substrate processing apparatus and semiconductor device manufacturing methodASAI MASAYUKI·Filed 2011·Granted Nov 3, 2015·1 cites·10 claims
- 3861US2025003068A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3961US2025104997A1Method of processing substrate, method of manufacturing semiconductor device, recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 4059US2005217577A1Vertical type semiconductor device producing apparatusHITACHI INT ELECTRIC INC·Filed 2005·Application pending·0 cites
- 4157US2009277382A1Semiconductor manufacturing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 4257US2009178694A1Substrate processing apparatusOKUDA KAZUYUKI·Filed 2009·Application pending·0 cites
- 4357US2013133696A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 4456US2025084535A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 4555US12148611B2Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 19, 2024·0 cites·20 claims
- 4655US11972934B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 30, 2024·0 cites·21 claims
- 4755US9349587B2Method of manufacturing semiconductor device and method of processing substrate and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Granted May 24, 2016·0 cites·19 claims
- 4855US2015101533A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 4955US2009181547A1Method of producing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 5054US2009205568A1Substrate processing method and substrate processing apparatusMIZUNO NORIKAZU·Filed 2009·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →