Inventor · disambiguated record
Seiyo Nakashima
Also filed as: NAKASHIMA SEIYO
17 granted patents·5 pending applications·80 citations·filing 2001–2023
92Inventor score
Files withHITACHI INT ELECTRIC INC8KOKUSAI ELECTRIC CORP7NAKASHIMA SEIYO3SHIMADA MASAKAZU2ABURATANI YUKINORI1
Top patents by PatentIndex Score
22 records- 0193US10825697B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 3, 2020·3 cites·10 claims
- 0288US8420167B2Method of manufacturing a semiconductor deviceNAKASHIMA SEIYO·Filed 2009·Granted Apr 16, 2013·9 cites·15 claims
- 0386US10163663B2Substrate processing apparatus, exhaust system and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Dec 25, 2018·5 cites·9 claims
- 0486US8277161B2Substrate processing apparatus and manufacturing method of a semiconductor deviceABURATANI YUKINORI·Filed 2008·Granted Oct 2, 2012·12 cites·22 claims
- 0582USD618638SReaction tubeHITACHI INT ELECTRIC INC·Filed 2008·Granted Jun 29, 2010·27 cites·1 claims
- 0680US7731797B2Substrate treating apparatus and semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2005·Granted Jun 8, 2010·7 cites·11 claims
- 0777US9394607B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 19, 2016·3 cites·15 claims
- 0876US7700054B2Substrate processing apparatus having gas side flow via gas inletHITACHI INT ELECTRIC INC·Filed 2007·Granted Apr 20, 2010·5 cites·12 claims
- 0973US12467689B2Furnace opening structure, substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 1069US8303712B2Substrate processing apparatus, method for manufacturing semiconductor device, and process tubeNAKASHIMA SEIYO·Filed 2009·Granted Nov 6, 2012·3 cites·15 claims
- 1166USD981972SAdiabatic plate for substrate processing appratusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 28, 2023·3 cites·1 claims
- 1262US2008173238A1Substrate processing apparatus, method of manufacturing semiconductor device, and reaction vesselHITACHI INT ELECTRIC INC·Filed 2007·Application pending·0 cites
- 1361US12338529B2Substrate processing apparatus, process vessel, method of manufacturing semiconductor device and non-transitory tangible mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jun 24, 2025·0 cites·16 claims
- 1455US2023343614A1Substrate processing apparatus, substrate holder, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1550USD982537SSeparator of substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 4, 2023·1 cites·1 claims
- 1649US2010229416A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 1747US2006075972A1Substrate processing apparatus and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2005·Application pending·0 cites
- 1845US12018373B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 25, 2024·0 cites·12 claims
- 1938US9698037B2Substrate processing apparatusNAKASHIMA SEIYO·Filed 2011·Granted Jul 4, 2017·0 cites·17 claims
- 2037US2002017363A1Substrate processing apparatus and substrate processing methodFiled 2001·Application pending·0 cites
- 2128USD652395SSemiconductor manufacturing equipmentSHIMADA MASAKAZU·Filed 2010·Granted Jan 17, 2012·1 cites·1 claims
- 2228USD651990SSemiconductor manufacturing equipmentSHIMADA MASAKAZU·Filed 2010·Granted Jan 10, 2012·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →