Inventor · disambiguated record
Yasuo Imai
Also filed as: IMAI YASUO
37 granted patents·10 pending applications·700 citations·filing 1992–2022
98Inventor score
Top patents by PatentIndex Score
47 records- 0198US6168996B1Method of fabricating semiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 2, 2001·263 cites·23 claims
- 0294US6455476B1Composition and process for lubricated plastic working of metalsHENKEL CORP·Filed 1999·Granted Sep 24, 2002·98 cites·19 claims
- 0391US12294182B2ConnectorSUMITOMO WIRING SYSTEMS·Filed 2022·Granted May 6, 2025·2 cites·5 claims
- 0491US6307231B1Method of fabricating semiconductor deviceHITACHI LTD·Filed 2000·Granted Oct 23, 2001·34 cites·14 claims
- 0588US6330871B1Cylinder head-integrated cylinder block and process for manufacturing the sameTOYOTA MOTOR CO LTD·Filed 2000·Granted Dec 18, 2001·29 cites·9 claims
- 0687US5640651ADeveloping deviceSHARP KK·Filed 1995·Granted Jun 17, 1997·45 cites·50 claims
- 0786US6803281B2Method of fabricating semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Oct 12, 2004·18 cites·6 claims
- 0886US6410959B2Method of fabricating semiconductor deviceHITACHI LTD·Filed 2001·Granted Jun 25, 2002·20 cites·9 claims
- 0985US11387578B2Shielded electrical connectorSUMITOMO WIRING SYSTEMS·Filed 2019·Granted Jul 12, 2022·7 cites·6 claims
- 1084US11094432B2Communication cable and crimping memberSUMITOMO WIRING SYSTEMS·Filed 2020·Granted Aug 17, 2021·1 cites·12 claims
- 1184US10707620B2ConnectorSUMITOMO WIRING SYSTEMS·Filed 2019·Granted Jul 7, 2020·5 cites·5 claims
- 1284US6512265B2Method of fabricating semiconductor deviceHITACHI LTD·Filed 2002·Granted Jan 28, 2003·17 cites·5 claims
- 1383US6720220B2Method of fabricating semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Apr 13, 2004·15 cites·5 claims
- 1482US6094550ADeveloping apparatusSHARP KK·Filed 1998·Granted Jul 25, 2000·33 cites·25 claims
- 1581US9972938B2ConnectorSUMITOMO WIRING SYSTEMS·Filed 2015·Granted May 15, 2018·5 cites·2 claims
- 1672US5239805AMethod of packing a developer cartridgeSHARP KK·Filed 1992·Granted Aug 31, 1993·20 cites·2 claims
- 1771US2010291242A1Antagonist against tolerance to anticancer drugsYOSHIKAZU SUGIMOTO·Filed 2009·Application pending·0 cites
- 1869US8076202B2Method of fabricating semiconductor deviceNUMAZAWA SUMITO·Filed 2010·Granted Dec 13, 2011·1 cites·16 claims
- 1968US12294181B2ConnectorSUMITOMO WIRING SYSTEMS·Filed 2022·Granted May 6, 2025·0 cites·5 claims
- 2067US12003060B2Connector and cover unit having shield and coverSUMITOMO WIRING SYSTEMS·Filed 2022·Granted Jun 4, 2024·0 cites·5 claims
- 2166US12322913B2Connector with improved shieldingSUMITOMO WIRING SYSTEMS·Filed 2022·Granted Jun 3, 2025·0 cites·7 claims
- 2266US9673561B2Connector and structure for fixing connector to wiring harnessSUMITOMO WIRING SYSTEMS·Filed 2015·Granted Jun 6, 2017·2 cites·2 claims
- 2365US12418142B2ConnectorSUMITOMO WIRING SYSTEMS·Filed 2022·Granted Sep 16, 2025·0 cites·4 claims
- 2463US8807886B2Hole cutterOMI SHOHEI·Filed 2010·Granted Aug 19, 2014·2 cites·9 claims
- 2562US9275863B2Method of fabricating semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 1, 2016·0 cites·3 claims
- 2662US5618486AProcess for manufacturing a heat-resistant molded foam productSEKISUI PLASTICS·Filed 1995·Granted Apr 8, 1997·26 cites·10 claims
- 2762US5235130ADeveloper cartridgeSHARP KK·Filed 1992·Granted Aug 10, 1993·14 cites·1 claims
- 2861USD394450SDeveloping unit for printer and facsimileSHARP KK·Filed 1995·Granted May 19, 1998·12 cites·1 claims
- 2961US2014225189A1Method of fabricating semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 3059US2008249036A1Antagonist Against Tolerance to Anticancer DrugsYOSHIKAZU SUGIMOTO·Filed 2005·Application pending·0 cites
- 3157US12327954B2Connector and cable with connectorSUMITOMO WIRING SYSTEMS·Filed 2021·Granted Jun 10, 2025·0 cites·10 claims
- 3257US5988956AHole cutterOMI KOGYO KK·Filed 1996·Granted Nov 23, 1999·21 cites·12 claims
- 3356US8354713B2Method of fabricating semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2011·Granted Jan 15, 2013·0 cites·10 claims
- 3454US8748266B2Method of fabricating semiconductor deviceNUMAZAWA SUMITO·Filed 2011·Granted Jun 10, 2014·0 cites·5 claims
- 3554US7180130B2Method of fabricating semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2004·Granted Feb 20, 2007·2 cites·7 claims
- 3652US7414012B2Aqueous lubricant for plastic working of metallic material and method for forming lubricant filmHENKEL KGAA·Filed 2003·Granted Aug 19, 2008·2 cites·16 claims
- 3752US2007290239A1Method of fabricating semiconductor deviceNUMAZAWA SUMITO·Filed 2007·Application pending·0 cites
- 3852US2007290268A1Method of fabricating semiconductor deviceNUMAZAWA SUMITO·Filed 2007·Application pending·0 cites
- 3952US2007278567A1Method of fabricating semiconductor deviceNUMAZAWA SUMITO·Filed 2007·Application pending·0 cites
- 4051US2007111423A1Method of fabricating semiconductor deviceNUMAZAWA SUMITO·Filed 2007·Application pending·0 cites
- 4142US5243389AToner hopper having stirring and feeding rollersSHARP KK·Filed 1992·Granted Sep 7, 1993·6 cites·10 claims
- 4239US2003167812A1Method of controlling water base-process type lubricating and processing fluid for cold forgingFiled 2001·Application pending·0 cites
- 4339US2003176294A1Aqueous one step type lubricanting agent for efficient cold forgingFiled 2001·Application pending·0 cites
- 4438US9899769B2Connector with an operating member mountable in either of two opposite orientations and locks for locking the operating member at an initial position and a connection position in either orientationSUMITOMO WIRING SYSTEMS·Filed 2017·Granted Feb 20, 2018·0 cites·5 claims
- 4538US2003130137A1Aqueous lubricant for plactic working of metallic material and method of lubricant film processingFiled 2003·Application pending·0 cites
- 4630US8888167B2Body structure of vehicleKUBO SATOSHI·Filed 2011·Granted Nov 18, 2014·0 cites·3 claims
- 4727US5545771AProcess for preparation of gem-difluoroalkanesNIPPON ZEON CO·Filed 1993·Granted Aug 13, 1996·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →