Assignee
ADVANCED CHIP ENG TECH INC
TW·35 granted patents·63 pending applications·720 citations·filing 2004–2010
Top patents by PatentIndex Score
98 records- 0198US7667318B2Fan out type wafer level package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2008·Granted Feb 23, 2010·56 cites·12 claims
- 0298US7339279B2Chip-size package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Mar 4, 2008·71 cites·13 claims
- 0396US7514767B2Fan out type wafer level package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2006·Granted Apr 7, 2009·50 cites·18 claims
- 0496US7238602B2Chip-size package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2004·Granted Jul 3, 2007·92 cites·32 claims
- 0595US7655501B2Wafer level package with good CTE performanceADVANCED CHIP ENG TECH INC·Filed 2008·Granted Feb 2, 2010·50 cites·10 claims
- 0695US7501310B2Structure of image sensor module and method for manufacturing of wafer level packageADVANCED CHIP ENG TECH INC·Filed 2007·Granted Mar 10, 2009·33 cites·27 claims
- 0794US7812434B2Wafer level package with die receiving through-hole and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Oct 12, 2010·31 cites·9 claims
- 0894US7557437B2Fan out type wafer level package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Jul 7, 2009·25 cites·18 claims
- 0993US7534632B2Method for circuits inspection and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted May 19, 2009·28 cites·15 claims
- 1092US7061106B2Structure of image sensor module and a method for manufacturing of wafer level packageADVANCED CHIP ENG TECH INC·Filed 2004·Granted Jun 13, 2006·55 cites·19 claims
- 1191US7453148B2Structure of dielectric layers in built-up layers of wafer level packageADVANCED CHIP ENG TECH INC·Filed 2006·Granted Nov 18, 2008·32 cites·18 claims
- 1289US7279782B2FBGA and COB package structure for image sensorADVANCED CHIP ENG TECH INC·Filed 2005·Granted Oct 9, 2007·21 cites·25 claims
- 1388US7459729B2Semiconductor image device package with die receiving through-hole and method of the sameADVANCED CHIP ENG TECH INC·Filed 2006·Granted Dec 2, 2008·16 cites·11 claims
- 1487US7911044B2RF module package for releasing stressADVANCED CHIP ENG TECH INC·Filed 2006·Granted Mar 22, 2011·18 cites·8 claims
- 1587US7423335B2Sensor module package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Sep 9, 2008·15 cites·19 claims
- 1685US7525185B2Semiconductor device package having multi-chips with side-by-side configuration and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Apr 28, 2009·14 cites·16 claims
- 1783US7566854B2Image sensor moduleADVANCED CHIP ENG TECH INC·Filed 2006·Granted Jul 28, 2009·7 cites·19 claims
- 1882US7335870B1Method for image sensor protectionADVANCED CHIP ENG TECH INC·Filed 2006·Granted Feb 26, 2008·11 cites·8 claims
- 1981US7884464B23D electronic packaging structure having a conductive support substrateADVANCED CHIP ENG TECH INC·Filed 2006·Granted Feb 8, 2011·16 cites·21 claims
- 2081US7884461B2System-in-package and manufacturing method of the sameADVANCED CHIP ENG TECH INC·Filed 2008·Granted Feb 8, 2011·9 cites·10 claims
- 2179US7176567B2Semiconductor device protective structure and method for fabricating the sameADVANCED CHIP ENG TECH INC·Filed 2005·Granted Feb 13, 2007·10 cites·8 claims
- 2278US7342296B2Wafer street buffer layerADVANCED CHIP ENG TECH INC·Filed 2005·Granted Mar 11, 2008·8 cites·10 claims
- 2378US7319043B2Method and system of trace pull testADVANCED CHIP ENG TECH INC·Filed 2005·Granted Jan 15, 2008·9 cites·14 claims
- 2474US7763494B2Semiconductor device package with multi-chips and method of the sameADVANCED CHIP ENG TECH INC·Filed 2008·Granted Jul 27, 2010·5 cites·21 claims
- 2573US7446546B2Method and system of trace pull testADVANCED CHIP ENG TECH INC·Filed 2007·Granted Nov 4, 2008·7 cites·7 claims
- 2671US7416920B2Semiconductor device protective structure and method for fabricating the sameADVANCED CHIP ENG TECH INC·Filed 2006·Granted Aug 26, 2008·5 cites·12 claims
- 2769US7687923B2Semiconductor device package having a back side protective schemeADVANCED CHIP ENG TECH INC·Filed 2007·Granted Mar 30, 2010·4 cites·10 claims
- 2866US7476565B2Method for forming filling paste structure of WL packageADVANCED CHIP ENG TECH INC·Filed 2007·Granted Jan 13, 2009·3 cites·16 claims
- 2963US7468544B2Structure and process for WL-CSP with metal coverADVANCED CHIP ENG TECH INC·Filed 2006·Granted Dec 23, 2008·2 cites·19 claims
- 3060US7863105B2Image sensor package and forming method of the sameADVANCED CHIP ENG TECH INC·Filed 2008·Granted Jan 4, 2011·0 cites·8 claims
- 3160US7498646B2Structure of image sensor module and a method for manufacturing of wafer level packageADVANCED CHIP ENG TECH INC·Filed 2006·Granted Mar 3, 2009·1 cites·19 claims
- 3259US7525139B2Image sensor with a protection layerADVANCED CHIP ENG TECH INC·Filed 2004·Granted Apr 28, 2009·7 cites·8 claims
- 3357US7224061B2Package structureADVANCED CHIP ENG TECH INC·Filed 2004·Granted May 29, 2007·8 cites·14 claims
- 3457US2008274579A1Wafer level image sensor package with die receiving cavity and method of making the sameADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
- 3555US2008136012A1Imagine sensor package and forming method of the sameADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 3654US2008197435A1Wafer level image sensor package with die receiving cavity and method of making the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3752US2008268647A1Method of plasma etching with pattern maskADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
- 3852US2010109156A1Back side protective structure for a semiconductor packageADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
- 3951US2007059866A1Fan out type wafer level package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 4050US7985626B2Manufacturing tool for wafer level package and method of placing diesADVANCED CHIP ENG TECH INC·Filed 2005·Granted Jul 26, 2011·0 cites·9 claims
- 4150US2009184425A1Conductive line structure and the method of forming the sameADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
- 4249US2008029877A1Method for separating package of wlpADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 4349US2008020511A1Structure of image sensor module and a method for manufacturing of wafer level packageADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 4449US2008142946A1Wafer level package with good cte performanceADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 4549US2008116169A1Method and structure of pattern mask for dry etchingADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 4649US2006105594A1Method for package burn-in testingADVANCED CHIP ENG TECH INC·Filed 2005·Application pending·0 cites
- 4749US2008157316A1Multi-chips package and method of forming the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 4848US2008118707A1Method and structure of pattern mask for dry etchingADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 4948US2007262051A1Method of plasma etching with pattern maskADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 5048US2008197474A1Semiconductor device package with multi-chips and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
Showing the top 50 of 98 patent records by PatentIndex Score.
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