Inventor
ISHII KATSUTOSHI
JP33 patents
⚠️ This page may combine multiple inventors who share the name “ISHII KATSUTOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
27 patentsUSD404372SJan 19, 1999
Ring for use in a semiconductor wafer heat processing apparatus
TOKYO ELECTRON LTD462 citations99
US6884295B2Apr 26, 2005
Method of forming oxynitride film or the like and system for carrying out the same
TOKYO ELECTRON LTD483 citations98
US6903030B2Jun 7, 2005
System and method for heat treating semiconductor
TOKYO ELECTRON LTD26 citations92
US6863732B2Mar 8, 2005
Heat treatment system and method
TOKYO ELECTRON LTD24 citations92
US6540509B2Apr 1, 2003
Heat treatment system and method
TOKYO ELECTRON LTD31 citations92
USD380454SJul 1, 1997
Wafer boat
TOKYO ELECTRON LTD25 citations92
US5820683AOct 13, 1998
Object-supporting boat
TOKYO ELECTRON LTD21 citations87
USD521464SMay 23, 2006
Process tube for semiconductor device manufacturing apparatus
TOKYO ELECTRON LTD15 citations84
USD521465SMay 23, 2006
Process tube for semiconductor device manufacturing apparatus
TOKYO ELECTRON LTD13 citations84
USD564462SMar 18, 2008
RF electrode for a process tube of semiconductor manufacturing apparatus
TOKYO ELECTRON LTD6 citations74
US7211295B2May 1, 2007
Silicon dioxide film forming method
TOKYO ELECTRON LTD7 citations74
USD520467SMay 9, 2006
Process tube for semiconductor device manufacturing apparatus
TOKYO ELECTRON LTD8 citations74
US6110286AAug 29, 2000
Vertical processing unit
TOKYO ELECTRON LTD8 citations74
USD428858SAug 1, 2000
Quartz fin heat retaining tube
TOKYO ELECTRON LTD7 citations74
USD427570SJul 4, 2000
Quartz fin heat retaining tube
TOKYO ELECTRON LTD12 citations74
USD410438SJun 1, 1999
Heat retaining tube for use in a semiconductor wafer heat processing apparatus
TOKYO ELECTRON LTD8 citations74
USD405428SFeb 9, 1999
Heat retaining tube for use in a semiconductor wafer heat processing apparatus
TOKYO ELECTRON LTD7 citations74
USD405427SFeb 9, 1999
Heat retaining tube for use in a semiconductor wafer heat processing apparatus
TOKYO ELECTRON LTD6 citations74
USD404016SJan 12, 1999
Heat retaining tube for use in a semiconductor wafer heat processing apparatus
TOKYO ELECTRON LTD8 citations74
US10535501B2Jan 14, 2020
Film forming apparatus, film forming method and non-transitory storage medium
TOKYO ELECTRON LTD2 citations72
USD429224SAug 8, 2000
Quartz fin heat retaining tube
TOKYO ELECTRON LTD4 citations63
USD426521SJun 13, 2000
Quartz fin heat retaining tube
TOKYO ELECTRON LTD3 citations63
USD425871SMay 30, 2000
Quartz fin heat retaining tube
TOKYO ELECTRON LTD3 citations63
US10799896B2Oct 13, 2020
Substrate processing apparatus, method of coating particle in process gas nozzle and substrate processing method
TOKYO ELECTRON LTD1 citations62
US11270895B2Mar 8, 2022
Gas introduction structure, treatment apparatus, and treatment method
TOKYO ELECTRON LTD0 citations52
US10876204B2Dec 29, 2020
Substrate processing apparatus, exhaust pipe coating method and substrate processing method
TOKYO ELECTRON LTD0 citations42
US10559460B2Feb 11, 2020
Film forming apparatus and film forming method
TOKYO ELECTRON LTD0 citations40