Inventor · disambiguated record
Shu-Sheng Chiang
Also filed as: CHIANG SHU-SHENG
23 granted patents·6 pending applications·49 citations·filing 2007–2017
93Inventor score
Top patents by PatentIndex Score
29 records- 0193US9609746B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Mar 28, 2017·9 cites·7 claims
- 0287US9161454B2Electrical device package structure and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2012·Granted Oct 13, 2015·8 cites·4 claims
- 0385US9860984B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jan 2, 2018·3 cites·12 claims
- 0474US9832873B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Nov 28, 2017·1 cites·6 claims
- 0574US8273256B2Method for manufacturing wiring structure of wiring boardCHIANG SHU-SHENG·Filed 2010·Granted Sep 25, 2012·2 cites·17 claims
- 0674US8164004B2Embedded circuit structure and fabricating process of the sameCHEN TSUNG-YUAN·Filed 2007·Granted Apr 24, 2012·5 cites·1 claims
- 0773US9510464B2Manufacturing method of circuit boardTSENG TZYY-JANG·Filed 2012·Granted Nov 29, 2016·2 cites·12 claims
- 0873US8729397B2Embedded structureLIU YI-CHUN·Filed 2011·Granted May 20, 2014·2 cites·20 claims
- 0973US8424202B2Process for fabricating a circuit boardTSENG TZYY-JANG·Filed 2010·Granted Apr 23, 2013·2 cites·13 claims
- 1071US8294034B2Circuit board and process for fabricating the sameTSENG TZYY-JANG·Filed 2010·Granted Oct 23, 2012·3 cites·20 claims
- 1169US9307651B2Fabricating process of embedded circuit structureCHEN TSUNG-YUAN·Filed 2012·Granted Apr 5, 2016·2 cites·7 claims
- 1268US8365401B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2010·Granted Feb 5, 2013·2 cites·10 claims
- 1366US8288663B2Electrical interconnect structure and process thereof and circuit board structureCHEN TSUNG-YUAN·Filed 2008·Granted Oct 16, 2012·2 cites·15 claims
- 1466US8191248B2Method for making an embedded structureLIU YI-CHUN·Filed 2008·Granted Jun 5, 2012·2 cites·18 claims
- 1565US8132321B2Method for making embedded circuit structureLIU YI-CHUN·Filed 2008·Granted Mar 13, 2012·2 cites·42 claims
- 1661US8450623B2Circuit boardTSENG TZYY-JANG·Filed 2010·Granted May 28, 2013·1 cites·8 claims
- 1761US8273651B2Method for fabricating wiring structure of wiring boardCHIANG SHU-SHENG·Filed 2010·Granted Sep 25, 2012·1 cites·19 claims
- 1858US9237643B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2012·Granted Jan 12, 2016·0 cites·5 claims
- 1958US2014034361A1Circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 2057US8365400B2Manufacturing process for a circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Feb 5, 2013·0 cites·13 claims
- 2157US2013206467A1Circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 2254US8051560B2Method of fabricating a solder pad structureUNIMICRON TECHNOLOGY CORP·Filed 2009·Granted Nov 8, 2011·0 cites·17 claims
- 2353US8578600B2Process for manufacturing a circuit boardTSENG TZYY-JANG·Filed 2010·Granted Nov 12, 2013·0 cites·11 claims
- 2453US2012160551A1Embedded structure of circuit boardLIU YI-CHUN·Filed 2012·Application pending·0 cites
- 2550US7926172B2Embedded circuit board and process thereofUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Apr 19, 2011·0 cites·10 claims
- 2650US2009273907A1Circuit board and process thereofUNIMICRON TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 2750US2009166059A1Circuit board and process thereofUNIMICRON TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 2849US2012312588A1Circuit boardTSENG TZYY-JANG·Filed 2012·Application pending·0 cites
- 2948US10271433B2Method of fabricating an electrical device package structureUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Apr 23, 2019·0 cites·6 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →