P

Inventor

ZHANG FUHONG

US41 patents

Patents

41 patents
USD801942SNov 7, 2017

Target profile for a physical vapor deposition chamber target

APPLIED MATERIALS INC336 citations99
USD797067SSep 12, 2017

Target profile for a physical vapor deposition chamber target

APPLIED MATERIALS INC355 citations98
USD946638SMar 22, 2022

Target profile for a physical vapor deposition chamber target

APPLIED MATERIALS INC20 citations94
USD869409SDec 10, 2019

Target profile for a physical vapor deposition chamber target

APPLIED MATERIALS INC22 citations94
USD868124SNov 26, 2019

Target profile for a physical vapor deposition chamber target

APPLIED MATERIALS INC28 citations94
USD837755SJan 8, 2019

Target profile for a physical vapor deposition chamber target

APPLIED MATERIALS INC30 citations94
USD836572SDec 25, 2018

Target profile for a physical vapor deposition chamber target

APPLIED MATERIALS INC30 citations94
USD825504SAug 14, 2018

Target profile for a physical vapor deposition chamber target

APPLIED MATERIALS INC34 citations93
US7294574B2Nov 13, 2007

Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement

APPLIED MATERIALS INC36 citations92
US9960024B2May 1, 2018

Biasable flux optimizer / collimator for PVD sputter chamber

APPLIED MATERIALS INC12 citations91
USD859333SSep 10, 2019

Collimator for a physical vapor deposition chamber

APPLIED MATERIALS INC14 citations85
USD858468SSep 3, 2019

Collimator for a physical vapor deposition chamber

APPLIED MATERIALS INC14 citations85
USD998575SSep 12, 2023

Collimator for use in a physical vapor deposition (PVD) chamber

APPLIED MATERIALS INC10 citations84
USD997111SAug 29, 2023

Collimator for use in a physical vapor deposition (PVD) chamber

APPLIED MATERIALS INC9 citations84
USD1038901SAug 13, 2024

Collimator for a physical vapor deposition chamber

APPLIED MATERIALS INC5 citations83
US10347474B2Jul 9, 2019

Biasable flux optimizer / collimator for PVD sputter chamber

APPLIED MATERIALS INC4 citations83
USD1009816SJan 2, 2024

Collimator for a physical vapor deposition chamber

APPLIED MATERIALS INC5 citations73
US11810770B2Nov 7, 2023

Methods and apparatus for controlling ion fraction in physical vapor deposition processes

APPLIED MATERIALS INC2 citations73
US11037768B2Jun 15, 2021

Methods and apparatus for controlling ion fraction in physical vapor deposition processes

APPLIED MATERIALS INC4 citations73
US10727033B2Jul 28, 2020

Biasable flux optimizer / collimator for PVD sputter chamber

APPLIED MATERIALS INC1 citations72
US10157733B2Dec 18, 2018

Methods for igniting a plasma in a substrate processing chamber

APPLIED MATERIALS INC2 citations72
US9991101B2Jun 5, 2018

Magnetron assembly for physical vapor deposition chamber

APPLIED MATERIALS INC3 citations69
USD1110289SJan 27, 2026

Process chamber collimator

APPLIED MATERIALS INC0 citations62
US12412738B1Sep 9, 2025

System for target arcing mapping and plasma diagnosis

APPLIED MATERIALS INC0 citations62
US12094699B2Sep 17, 2024

Methods and apparatus for controlling ion fraction in physical vapor deposition processes

APPLIED MATERIALS INC0 citations62
US11270898B2Mar 8, 2022

Apparatus for enhancing flow uniformity in a process chamber

APPLIED MATERIALS INC0 citations62
US11335577B2May 17, 2022

Methods and apparatus to prevent interference between processing chambers

APPLIED MATERIALS INC0 citations61
US11309169B2Apr 19, 2022

Biasable flux optimizer / collimator for PVD sputter chamber

APPLIED MATERIALS INC0 citations61
US10438828B2Oct 8, 2019

Methods and apparatus to prevent interference between processing chambers

APPLIED MATERIALS INC1 citations61
USD1110975SFeb 3, 2026

Collimator for a physical vapor deposition (PVD) chamber

APPLIED MATERIALS INC0 citations60
US11222816B2Jan 11, 2022

Methods and apparatus for semi-dynamic bottom up reflow

APPLIED MATERIALS INC0 citations60
US11492699B2Nov 8, 2022

Substrate temperature non-uniformity reduction over target life using spacing compensation

APPLIED MATERIALS INC0 citations59
US11289329B2Mar 29, 2022

Methods and apparatus for filling a feature disposed in a substrate

APPLIED MATERIALS INC0 citations58
US12553125B2Feb 17, 2026

Protective gas flow during wafer dechucking in PVD chamber

APPLIED MATERIALS INC0 citations53
US11527437B2Dec 13, 2022

Methods and apparatus for intermixing layer for enhanced metal reflow

APPLIED MATERIALS INC0 citations52
US11393665B2Jul 19, 2022

Physical vapor deposition (PVD) chamber with reduced arcing

APPLIED MATERIALS INC0 citations52
US10283334B2May 7, 2019

Methods and apparatus for maintaining low non-uniformity over target life

APPLIED MATERIALS INC0 citations52
US11562925B2Jan 24, 2023

Method of depositing multilayer stack including copper over features of a device structure

APPLIED MATERIALS INC0 citations51
US12203163B2Jan 21, 2025

Methods for shaping magnetic fields during semiconductor processing

APPLIED MATERIALS INC0 citations47
US11315771B2Apr 26, 2022

Methods and apparatus for processing a substrate

APPLIED MATERIALS INC0 citations46
US9831075B2Nov 28, 2017

Source magnet for improved resputtering uniformity in direct current (DC) physical vapor deposition (PVD) processes

APPLIED MATERIALS INC0 citations41